Mechanical Integration #
B3 TEM Mounting #
The Transducer Electronics Module (TEM) is fixed to a base-plate in the system housing using four tapped stand-offs, which are supplied with the OEM system. These stand-offs are selected to give the correct height from the boards to the base-plate and between the two boards.
The TEM fixing holes are 3.2mm diameter, and the stand-offs supplied are M3.
The locations of the fixings are shown below.
B3 TEM Top View #
B3 TEM Side View #
B3 TEM mounting fasteners #
All dimensions are in millimetres.
Cooling TEM #
Ideally, fit the TEMs to a thermally-conductive base-plate. Use thermal pads to provide a cooling path from the FPGA and sonar interface ICs (the three large chips on the bottom of the board). Fit a fan to circulate air inside the housing that holds the TEM.
The TEM uses 10W power, so generates roughly the same as heat inside the housing. Most system housings are easily capable of dissipating this amount of heat energy in air or in water, but without a fan and/or thermal pads, parts of the TEMs can become too hot. The TEMs are provided with temperature sensors, and their readings are reported to the user through the Bathyswath Swath Processor software, and recorded with the raw sonar data files. The Bathyswath software has the option to disable TEM operation if the temperature exceeds a user-set limit.
B3 TCB Mounting #
Low frequency Transducer Connection Board (TCB) to be used with 250, 900, 1000 kHz multi/single frequency transducer (see below).
High frequency Transducer Connection Board (TCB) to be used with 450, 900, 1600 kHz multi/single frequency transducer (see below).
